Abstract:
In this study electroplating of Iron with Copper on different electroplating conduction were studied concentration of Copper, current, density, time and PH were carried out to investigate the relation between the Wight, density of Copperelectrodeposition.
From the above systematic investigation the suitable conditions for Copper electroplating were found as follow:
PH(4), Concentration of Copper sulphate in bath(0.08)M, Current(0.06)A/cm2, Time to be plated(20)min. (in room temperature)
