DSpace JSPUI
DSpace preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
Learn More
Please use this identifier to cite or link to this item:
https://repository.sustech.edu/handle/123456789/9340| Title: | Electroplating Of Copper |
| Authors: | Taha, Eman Almutasim Ali Supervisor - Mohammed Sulieman Ali Eltom |
| Keywords: | Scientific Laboratories Electroplating Copper |
| Issue Date: | 10-Jul-2014 |
| Publisher: | Sudan University of Science and Technology |
| Citation: | Taha,Eman Almutasim Ali .Electroplating Of Copper/Eman Almutasim Ali Taha;Mohammed Sulieman Ali Eltom.-khartoum:Sudan University of Science and Technology,College of Sciences,2014.-25p. :ill;28cm.-Basheors,search . |
| Abstract: | In this study electroplating of Iron with Copper on different electroplating conduction were studied concentration of Copper, current, density, time and PH were carried out to investigate the relation between the Wight, density of Copperelectrodeposition. From the above systematic investigation the suitable conditions for Copper electroplating were found as follow: PH(4), Concentration of Copper sulphate in bath(0.08)M, Current(0.06)A/cm2, Time to be plated(20)min. (in room temperature) |
| Description: | Basheors,search |
| URI: | http://repository.sustech.edu/handle/123456789/9340 |
| Appears in Collections: | Bachelor of Science |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Electroplating Of Copper.pdf | title | 137.27 kB | Adobe PDF | View/Open |
| Abstract.pdf | Abstract | 423.75 kB | Adobe PDF | View/Open |
| Resaerch.pdf | Resaerch | 519.39 kB | Adobe PDF | View/Open |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.