Enhancement of Heat Transfer Using Perforated Pin Fin

Abstract

Today is very important to save our electronics devices by making a new technic to enhance the heat transfer through the pin fin one of the technic is the perforation which mean cut of some material from the body. A base plate of Aluminum thickness of 20mm and (100*100) mm2 as a dimensions and it consider as heat source by putting 3 heaters 80mm length with 10mm diameter 200 watts for each one ,the fins is fixed on the plate like a bolts to ensure open and connect again and the thermocouples are fixed on the fin by small bolts. The model was putted on a duct constructed of aluminum foil with dimensions of (1000*200*200) mm3 and a fan mounted at one operating at speed (0-3m/sec) was used in the tests. To get readings, the working model was fixed within the duct. The number of holes in each test of perforation varies from one to four for each fin and each time readings are tabulated. The results shows that the Nusselt number ,fin efficiency increases with perforation increase, pressure drop and the weight of the device decrease with perforation increase. As a result, thermal boundary thickness was reduced, it will be decreasing the pumping power and the device is protected from damage. The processor found in electronic computers and micro-devices that contain processors for processes and activities that take place in industrial, commercial, and even military organizations is the closest approximation to the field of application of the research.