Electro-deposition of Copper from Sulfate Bath

Abstract

This work reports the effects of different parameters on the thickness of the deposited copper, on the steel cathode using Faradays first law of electroplating and the crystalline state of the deposited copper using X-ray diffraction and explains of the influence of different processing parameter on the properties of the deposited copper film. Electro deposition of copper was affected by different parameters including concentration, current, time and pH. In this research, copper was plated onto the surface of iron thin sheets with approximately 2 x 2 cm² diameter. Copper from the anode is oxidized to Cu²⁺ which is reduced at the cathode to form the solid copper plating. The copper sulfate solution serves as an electrolyte solution as well as the source of the Cu²⁺ to be plated on the cathode, sulfuric acid solution was added as an additional electrolyte, and diluted hydrochloric acid (0.1 M) was added to reduce anode polarization. The optimum conditions for this process were found to be when the copper sulfate concentration was 0.10 M, at current density of 0.40 A/cm2 and pH 3 with time 50 min. X-ray diffraction tests for plated and un-plated steel showed that the peaks characteristic of copper appeared in the plated sheets. Enhancement of corrosion protection was observed in the plated sheet in comparison with the unplated one.