Electroplating Of Copper

dc.contributor.author	Taha, Eman Almutasim Ali
dc.contributor.author	Supervisor - Mohammed Sulieman Ali Eltom
dc.date.accessioned	2014-12-29T07:20:46Z
dc.date.available	2014-12-29T07:20:46Z
dc.date.issued	2014-07-10
dc.identifier.citation	Taha,Eman Almutasim Ali .Electroplating Of Copper/Eman Almutasim Ali Taha;Mohammed Sulieman Ali Eltom.-khartoum:Sudan University of Science and Technology,College of Sciences,2014.-25p. :ill;28cm.-Basheors,search .	en_US
dc.identifier.uri	http://repository.sustech.edu/handle/123456789/9340
dc.description	Basheors,search	en_US
dc.description.abstract	In this study electroplating of Iron with Copper on different electroplating conduction were studied concentration of Copper, current, density, time and PH were carried out to investigate the relation between the Wight, density of Copperelectrodeposition. From the above systematic investigation the suitable conditions for Copper electroplating were found as follow: PH(4), Concentration of Copper sulphate in bath(0.08)M, Current(0.06)A/cm2, Time to be plated(20)min. (in room temperature)	en_US
dc.description.sponsorship	Sudan University of Science and Technology	en_US
dc.language.iso	en	en_US
dc.publisher	Sudan University of Science and Technology	en_US
dc.subject	Scientific Laboratories	en_US
dc.subject	Electroplating	en_US
dc.subject	Copper	en_US
dc.title	Electroplating Of Copper	en_US
dc.type	Thesis	en_US