Abstract:
In this research the effect of current density, temperature, pH, concentration of nickel chloride solution and electroplating time on nickel electroplating of copper from glycine and acetate baths were investigated.
It was observed that a bath concentration 0.5 mole/L of nickel chloride solution gave the best nickel deposit at 0.5 A/cm2 for 10 min at concentration of both sodium sulphate and ammonium chloride were 0.2 mole/L and the suitable pH was found to be 5.
The effects of glycine and sodium acetate concentration of baths were studied and the weight of copper plate increased according to increasing their concentration in the bath which obey Faraday law.
The corrosion test was applied to compare between the copper sheet before and after the plating process. The result obtained showed that the plating process greatly enhanced the corrosion resistance of the plated copper over unplated sheet.
